iesy GmbH
17 Produkte
Standard heatspreader for COM Express Basic Type 7 module conga-B7AC with integrated copper plate. Intended for versions up to 17W TDP (Cu = Copper plate | T = M2.5 threaded standoffs)
Active cooling solution with heatpipes for conga-B7XD COM Express basic type 7 module from congatec.
Heat spreader with vapor chamber for conga-B7XD COM Express basic module from congatec.
Heatspreader for LEC-PX30 by ADLINK
Standard heatspreader for conga-MA5 COM Express mini module from congatec.
Standard heatspreader for Qseven modules conga-QA3 and QA3E from congatec.
Standard heatspreader for Qseven module conga-QA4 from congatec.
Passive cooling solution for Qseven module conga-QA5 from congatec.
Standard heatspreader for Qseven module conga-QA5 from congatec.
Standard heatspreader for Qseven module conga-QG from congatec.
Standard heat spreader for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM processor. All standoffs are with 2.7mm bore hole
Passive cooling solution for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
1 Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded.
Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.
Standard heatspreader for COM Express compact TCA5 module from congatec.
Low profile heatsink for LEC-PX30
Standard heatspreader for high performance COM Express module conga-TR4 with integrated heat pipes.
All standoffs are M2.5mm thread.
Sampling orders only (1 pcs). RRP means „recommended retail price“.
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