Product

The conga-TC170 i5-6300U module with COM Express™ type 6 pinout is equipped with the ULV-SoC edition of the sixth generation Intel Core i5 processors (code name: Sky Lake). For the first time, they offer a configurable TDP (Thermal Design Power) of 7.5 to 15 watts, which simplifies matching the application to the system’s thermal design. The power supply has also been optimized, which in addition to the new microarchitecture also contributes to the energy efficiency and allows a longer turbo-boost. Another new feature is the support of up to 32GB of fast dual channel RAM, which in the DDR4 version provides significantly more bandwidth and is much more energy efficient than the DDR3 version. The integrated Intel Gen 9 Graphics, which is premiering with this new microarchitecture, supplies up to three independently operated 4k displays with 60 Hz via DisplayPort 1.2. Version 2.0 of HDMI is also supported for the first time as well as version 12 of DirectX for even faster, Windows 10 based 3D graphics. Now not only the decoding but also the encoding of HEVC, VP8, VP9 and VDENC is hardware-supported. Energy-efficient streaming of HD videos in both directions is possible for the first time. Additional enhancements are the number of USB 3.0 ports (now 4), SATA Gen 3 (now 3), PCIe Gen 3 (now 6) as well as AMT (now version 11.0).

Further COM Express™ Type 6 pinout-compliant interfaces include PEG, Gigabit Ethernet, 8x USB 2.0, LPC plus I²C and UART. Thanks to the optional MIPI camera interfaces, CSI2 camera sensors can also be connected directly. Operating system support is offered for all popular Linux distributions and Microsoft Windows variants – including Microsoft Windows 10. Extensive, design-in-simplifying options – such as heatsinks, carrier boards and starter kits as well as SMART Battery Management Modules – round out congatec’s offering.