Passive cooling solutions for Qseven based on heat spreaders significantly help redcucing temperature and thus allow for higher efficiency and less wear, even for high-performance processors with high TDP.
Starter kits allow you a quick start with Qseven. Evaluation carrier boards / eval kits output all Qseven signals to standard interfaces and thus enable thorough testing.
Thermal design is one of the aspects in the specification of the SMARC standard for embedded computer modules. As a passive cooling solution, a heat spreader can be used to dissipate the heat of the active components in order to cool the entire system.
SMARC eval boards are made for rapid development of embedded systems. Choose from the wide range of different SMARC modules the one that suits your needs the best, install the respective module on your SMARC evaluation carrier and start developing instantly.
Efficient passive cooling solutions (heat spreader) allow higher performance and less wear, especially for COM Express compact modules with high TDP performance processors.
Efficient passive cooling solutions (i.e. heat spreaders, heatpipes) allow higher performance and less wear when using COM Express basic modules, even with processors with high TDP performance.
COM Express mini modules can achieve more performance with the help of passive cooling solutions (e.g. heat spreaders, heatpipes) while reducing wear, even with processors with high TDP performance.
For a quick start with COM Express Type 7, the use of an eval board is recommended to route all COM Express signals to standard interfaces. Supported are modules with type 7 pinout for COM Express compact and basic.