Product

In terms of graphics processing the conga-TS170 COM Express module sets benchmarks: due to support for Intel® Advanced Vector Extensions 2.0 (Intel® AVX2) and OpenCL 2.0, the new modules process high-parallel tasks extremely efficient. Moreover, carrying up to 32 GB of particularly fast 2133 DDR4 memory, leads to an increased performance making the COM Express modules particularly suitable for data-intensive applications.

The integrated Intel® Gen9 HD Graphics allows for up to three independent 4K displays (3840 x 1260) via HDMI 1.4, DVI and DisplayPort 1.2. An additional dual-channel LVDS output is provided. For a high-quality display quality and 3D features Intel Graphics comes with support for DirectX12 and OpenGL 4.3. The integrated video transcoder relieves the CPU by providing video streams in different formats in real time.

Numerous I/O interfaces, such as PCI Express Gen 3.0, USB 3.0/2.0 as well as LPC and I²C provide for a wide variety of connectivity. In addition, the conga-TS170 COM Express modules offers 4 x SATA III support for mass-storage, etc. Thanks to Intel® AMT 9.1 and congatec’s board management controller, including watch dog timer and power loss control, the modules are fully equipped for remote monitoring, management and maintenance tasks, all the way up to out-of-band management. In terms of operating systems all popular Linux and Microsoft operating systems are supported. In addition, the modules are already prepared for Microsoft Windows 10.

Thanks to the performance of the Sky Lake H-Series and Intel Xeon processors, the new conga-TS170 COM Express Basic modules achieve server-level performance and trump in terms of overall and graphics performance. Intel’s powerful processor and graphics Media Engine provides an immersive user experience with fast 3D rendering and realistic shading with optimal refresh rates. The new conga-TS170 high-end module is designed for any industry sector where applications with customized I/O and IoT interface configurations must meet the highest performance standards in the smallest space.